Xi'an Institute of Optics and Precision Mechanics,CAS
Mass transfer of micro structures using adhesives | |
其他题名 | Mass transfer of micro structures using adhesives |
CHONG, WING CHEUNG; ZHANG, LEI; OU, FANG; LI, QIMING | |
2019-06-18 | |
专利权人 | HONG KONG BEIDA JADE BIRD DISPLAY LIMITED |
公开日期 | 2019-06-18 |
授权国家 | 美国 |
专利类型 | 授权发明 |
摘要 | Mass transfer of micro structures are effected from one substrate to another using adhesives. In the context of an integrated micro LED display, a micro LED array is fabricated on a native substrate and corresponding CMOS pixel drivers are fabricated on a separate substrate. The micro LED substrate (e.g., sapphire) and the CMOS substrate (e.g., silicon) may be incompatible. For example, they may have different thermal coefficients of expansion which make it difficult to bond the micro LEDs to the pixel driver circuitry. The micro LED array is transferred to an intermediate substrate (e.g., silicon) by use of an adhesive. This intermediate substrate may be used in a process of bonding the micro LED array to the array of pixel drivers. The intermediate substrate is separated from the micro LED array by releasing the adhesive. |
其他摘要 | 使用粘合剂从一个基底到另一个基底实现微结构的传质。在集成微LED显示器的背景下,在原生衬底上制造微LED阵列,并且在单独的衬底上制造相应的CMOS像素驱动器。微LED基板(例如,蓝宝石)和CMOS基板(例如,硅)可能是不兼容的。例如,它们可能具有不同的热膨胀系数,这使得难以将微LED结合到像素驱动器电路。通过使用粘合剂将微LED阵列转移到中间衬底(例如,硅)。该中间衬底可以用于将微LED阵列键合到像素驱动器阵列的过程中。通过释放粘合剂将中间基板与微LED阵列分离。 |
授权日期 | 2019-06-18 |
申请日期 | 2017-12-08 |
专利号 | US10325893 |
专利状态 | 授权 |
申请号 | US15/836703 |
公开(公告)号 | US10325893 |
IPC 分类号 | H01L21/00 | H01L33/62 | H01L25/16 | H01L33/00 | H01L33/08 | H01L27/15 | H01L25/075 | H01L27/12 | H01L33/32 |
专利代理人 | - |
代理机构 | FENWICK & WEST LLP |
文献类型 | 专利 |
条目标识符 | http://ir.opt.ac.cn/handle/181661/38047 |
专题 | 半导体激光器专利数据库 |
作者单位 | HONG KONG BEIDA JADE BIRD DISPLAY LIMITED |
推荐引用方式 GB/T 7714 | CHONG, WING CHEUNG,ZHANG, LEI,OU, FANG,et al. Mass transfer of micro structures using adhesives. US10325893[P]. 2019-06-18. |
条目包含的文件 | ||||||
文件名称/大小 | 文献类型 | 版本类型 | 开放类型 | 使用许可 | ||
US10325893.PDF(1932KB) | 专利 | 开放获取 | CC BY-NC-SA | 请求全文 |
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