Semiconductor light emitting device packages and methods

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	Semiconductor light emitting device packages and methods
其他题名	Semiconductor light emitting device packages and methods
	LOH, BAN P.; CANNON, NATHANIEL O.; HILLER, NORBERT; EDMOND, JOHN; JACKSON, MITCH; MEDENDORP, JR., NICHOLAS W.
	2014-07-29
专利权人	CREE, INC.
公开日期	2014-07-29
授权国家	美国
专利类型	授权发明
摘要	A submount for a light emitting device package includes a substrate. A first bond pad and a second bond pad are on a first surface of the substrate. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode thereon. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are a the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad. Related LED packages and methods of forming LED packages are disclosed.
其他摘要	用于发光器件封装的基座包括基板。第一接合垫和第二接合垫位于基板的第一表面上。第一接合焊盘包括朝向基板的第一端偏移的管芯附接区域，并且被配置为在其上接收发光二极管。第二接合垫包括第一接合垫和基板的第二端之间的接合区域以及第二接合垫延伸部，该第二接合垫延伸部沿着基板的一侧从接合区域朝向基板的第一端处的基板的角部延伸。基质。第一和第二焊盘是衬底的第二表面。第一焊盘与基板的第一端相邻并接触第二接合焊盘。第二焊盘与基板的第二端相邻并接触第一焊盘。公开了相关的LED封装和形成LED封装的方法。
授权日期	2014-07-29
申请日期	2011-06-20
专利号	US8791491
专利状态	授权
申请号	US13/164185
公开（公告）号	US8791491
IPC 分类号	H01L33/54 \| H01L33/48 \| H01L33/00 \| H01L33/62
专利代理人	-
代理机构	MYERS BIGEL SIBLEY & SAJOVEC, P.A.
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/37521
专题	半导体激光器专利数据库
作者单位	CREE, INC.
推荐引用方式 GB/T 7714	LOH, BAN P.,CANNON, NATHANIEL O.,HILLER, NORBERT,et al. Semiconductor light emitting device packages and methods. US8791491[P]. 2014-07-29.