Xi'an Institute of Optics and Precision Mechanics,CAS
| Photo-semiconductor module | |
| 其他题名 | Photo-semiconductor module |
| MASUKO TAKAYUKI; OKAMOTO AKIRA; MORIYA KAORU; OKAMURA KOJI; ARIMA TADAO | |
| 1993-06-01 | |
| 专利权人 | FUJITSU LIMITED |
| 公开日期 | 1990-12-19 |
| 授权国家 | 加拿大 |
| 专利类型 | 授权发明 |
| 摘要 | Abstract of the Disclosure A photo-semiconductor module is disclosed wherein a reliable airtight condition can be obtained and an operability in assembly can be improved. The photo-semiconductor module comprises a substrate carried in a casing, a photo-semiconductor chip mounted on the substrate, and a support member carried on the substrate and having an inclined face which is inclined by an angle of 45 degrees with respect to a surface of the substrate. A semi-spherical lens is securely mounted on the inclined face of the support member, and an opening formed in a side wall of the casing is sealed airtight by a glass member while an upper portion of the casing is sealed airtight by a lid. When an optical fiber is mounted onto the casing such that an end face thereof may be located in the opening in the side wall of the casing, the optical fiber and the photo-semiconductor chip are optically coupled to each other by way of the semi-spherical lens. |
| 其他摘要 | 发明内容公开了一种光半导体模块，其中可以获得可靠的气密条件并且可以提高组装的可操作性。光半导体模块包括承载在壳体中的基板，安装在基板上的光半导体芯片，以及承载在基板上并具有倾斜面的支撑构件，该倾斜面相对于表面倾斜45度角基材半球形透镜牢固地安装在支撑构件的倾斜面上，并且形成在壳体的侧壁中的开口由玻璃构件气密地密封，同时壳体的上部通过盖子气密地密封。当光纤安装到壳体上使得其端面可以位于壳体侧壁的开口中时，光纤和光半导体芯片通过半导体光学耦合到彼此。球面透镜。 |
| 授权日期 | 1993-06-01 |
| 申请日期 | 1990-06-15 |
| 专利号 | CA2019074C |
| 专利状态 | 失效 |
| 申请号 | CA2019074 |
| 公开（公告）号 | CA2019074C |
| IPC 分类号 | H01L27/14 | G02B6/42 | H01L31/0203 | H01L31/0232 |
| 专利代理人 | FETHERSTONHAUGH & CO. |
| 代理机构 | - |
| 文献类型 | 专利 |
| 条目标识符 | http://ir.opt.ac.cn/handle/181661/35986 |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | FUJITSU LIMITED |
| 推荐引用方式 GB/T 7714 | MASUKO TAKAYUKI,OKAMOTO AKIRA,MORIYA KAORU,et al. Photo-semiconductor module. CA2019074C[P]. 1993-06-01. |
| 条目包含的文件 | 条目无相关文件。 | |||||
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