WÄRMEABLEITER, LASERMODUL, LASER-VORRICHTUNG UND LASER-VERARBEITUNGSVORRICHTUNG

OPT OpenIR > 半导体激光器专利数据库

	WÄRMEABLEITER, LASERMODUL, LASER-VORRICHTUNG UND LASER-VERARBEITUNGSVORRICHTUNG
其他题名	WÄRMEABLEITER, LASERMODUL, LASER-VORRICHTUNG UND LASER-VERARBEITUNGSVORRICHTUNG
	KOUTA HIKARU; TAKAHASHI HISAYA; MIKUBO KAZUYUKI; ONO HIDEYUKI; TUNEKANE MASAKI; ISHIDA TOSHINORI; KUBOTA KEIICHI
	2009-12-24
专利权人	LASERFRONT TECHNOLOGIES INC.
公开日期	2009-12-24
授权国家	德国
专利类型	授权发明
摘要	A pair of opening portions are provided as an inlet port of refrigerant and an outlet port thereof, and refrigerant flow channels are formed left-right symmetrically in its plan view from one opening portion to the other opening portion. At the area adjusted to the area which is thermally connected to the heating element in the refrigerant flow channels, projections whose cross section thereof become smaller and smaller upward from the bottom surface of the refrigerant flow channels or downward from the upper surface, that is, widens toward the end, are formed. By joining the heat radiating plate having the projections formed therein to the other heat radiating plate, which is plate-shaped, together, a heat sink is assembled. Therefore, the heat sinks are excellent in terms of thermal conductivity and reliability, are produced at a low cost, and a laser module employing the same, a laser module apparatus, and a laser processing apparatus are obtainable.
其他摘要	设置一对开口部分作为制冷剂的入口和其出口，并且制冷剂流动通道在其平面图中从一个开口部分到另一个开口部分左右对称地形成。在调节到与制冷剂流动通道中的加热元件热连接的区域的区域，突出部分的横截面从制冷剂流动通道的底表面向上或从上表面向下变小和变小，即，形成了最终的扩展。通过将其中形成有突起的散热板连接到另一个板状的散热板，组装散热器。因此，散热器在导热性和可靠性方面是优异的，以低成本生产，并且可获得采用该散热器的激光模块，激光模块设备和激光加工设备。
申请日期	2004-02-18
专利号	DE602004024042D1
专利状态	失效
申请号	DE602004024042
公开（公告）号	DE602004024042D1
IPC 分类号	F28D15/02 \| H01L23/46 \| H01L23/473 \| H01S3/094 \| H01S5/024
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/33883
专题	半导体激光器专利数据库
作者单位	LASERFRONT TECHNOLOGIES INC.
推荐引用方式 GB/T 7714	KOUTA HIKARU,TAKAHASHI HISAYA,MIKUBO KAZUYUKI,et al. WÄRMEABLEITER, LASERMODUL, LASER-VORRICHTUNG UND LASER-VERARBEITUNGSVORRICHTUNG. DE602004024042D1[P]. 2009-12-24.