Development of the electronics system prototype of the high-speed camera | |
Zheng, Yang1,2; Li, Ruimin1,2; Song, Zongxi1![]() | |
2017-11-27 | |
会议名称 | 3rd IEEE Information Technology and Mechatronics Engineering Conference, ITOEC 2017 |
会议录名称 | Proceedings of 2017 IEEE 3rd Information Technology and Mechatronics Engineering Conference, ITOEC 2017 |
卷号 | 2017-January |
页码 | 1155-1159 |
会议日期 | 2017-10-03 |
会议地点 | Chongqing, China |
出版者 | Institute of Electrical and Electronics Engineers Inc. |
产权排序 | 1 |
摘要 | The high-speed camera is an imaging device that records a particular transient state or all of the high-speed processes. It can accurately record the transient process of the high-speed target in real time and thus allow us to achieve the purpose of analysis of high-speed process through the slow motion playback. So the high-speed camera becomes an important tool for the study of the transient phenomena. This paper presents the development of a high-speed imaging system, which was build based upon a CMOS (Complementary Metal Oxide Semiconductor) image sensor and a high density FPGA (Field Programmable Gate Array) and USB 3.0 (Universal Serial Bus 3.0). In this paper, the design methodology and the electronics system architecture are briefly discussed. Besides, the designs and implements are particularly depicted. Finally the experimental verification shows the correlated results. The system has the advantage of high frame rate, high resolution, high performance and flexibility. © 2017 IEEE. |
作者部门 | 空间光学应用研究室 |
DOI | 10.1109/ITOEC.2017.8122537 |
收录类别 | EI |
ISBN号 | 9781509053629 |
语种 | 英语 |
引用统计 | |
文献类型 | 会议论文 |
条目标识符 | http://ir.opt.ac.cn/handle/181661/29992 |
专题 | 空间光学技术研究室 |
作者单位 | 1. Xi'an Institute of Optics and Precision Mechanics Chinese Academy of Sciences Xi'an, Shaanxi Province, China 2. University of Chinese Academy of Sciences, Beijing, China |
推荐引用方式 GB/T 7714 | Zheng, Yang,Li, Ruimin,Song, Zongxi. Development of the electronics system prototype of the high-speed camera[C]:Institute of Electrical and Electronics Engineers Inc.,2017:1155-1159. |
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