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Unsupervised feature learning for scene classification of high resolution remote sensing image
Fu, Min1,2; Yuan, Yuan1; Lu, Xiaoqiang1
2015
会议名称IEEE China Summit and International Conference on Signal and Information Processing, ChinaSIP 2015
会议录名称2015 IEEE China Summit and International Conference on Signal and Information Processing, ChinaSIP 2015 - Proceedings
页码206-210
会议日期2015-07
会议地点Chengdu, China
出版者Institute of Electrical and Electronics Engineers Inc.
产权排序1
摘要Due to the rapid development of various satellite sensors, a large amount of high resolution remote sensing images can be obtained. In order to efficiently represent the scenes from these high resolution images, an unsupervised feature learning method is proposed for high resolution image scene classification. In the proposed method, a set of filter banks are learned in an unsupervised manner from the unlabeled image patches, which are robust, efficient and do not need elaborately designed descriptors such as SIFT. And then, each image is encoded by these filter banks using a soft distance assignment scheme, generating a final feature vector to excellently represent the image scene. Finally, by virtue of the traditional SVM classifier, the sematic concepts of different scenes can be categorized. Experimental evaluation on the the high resolution remote sensing images demonstrates the effectiveness and good performance of the proposed method. © 2015 IEEE.
作者部门光学影像学习与分析中心
DOI10.1109/ChinaSIP.2015.7230392
收录类别EI
ISBN号9781479919482
语种英语
引用统计
文献类型会议论文
条目标识符http://ir.opt.ac.cn/handle/181661/27822
专题光谱成像技术研究室
通讯作者Lu, Xiaoqiang
作者单位1.Center for OPTical IMagery Analysis and Learning (OPTIMAL), State Key Laboratory of Transient Optics and Photonics, Xi'An Institute of Optics and Precision Mechanics, Xi'an Shaanxi, China
2.University of the Chinese Academy of Sciences, 19A Yuquanlu, Beijing, China
推荐引用方式
GB/T 7714
Fu, Min,Yuan, Yuan,Lu, Xiaoqiang. Unsupervised feature learning for scene classification of high resolution remote sensing image[C]:Institute of Electrical and Electronics Engineers Inc.,2015:206-210.
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