| A Study on the technical method of drilling micro holes on new CMC-SiC with femtosecond laser | |
| Feng, Wang; Luo, Jian Jun; Li, Ming; Deng, Yue | |
| 2014 | |
| 会议名称 | International Conference on Vehicle and Mechanical Engineering and Information Technology, VMEIT 2014 |
| 会议录名称 | Vehicle, Mechatronics and Information Technologies II |
| 页码 | 3924-3930 |
| 会议日期 | 2014-02-19 |
| 会议地点 | Beijing, China |
| 会议主办者 | INTIEA Information and Engineering; Scientific.Net; Trans Tech publications inc.; National Institute of Technology Rourkela; Universitatea Politehnica Din Bucuresti; et al |
| 出版者 | Trans Tech Publications Ltd, Kreuzstrasse 10, Zurich-Durnten, CH-8635, Switzerland |
| 产权排序 | 2 |
| 摘要 | To solve the difficulties of processing micro holes on the CMC-SiC, femtosecond laser was used as the drilling tool in this paper. And a new type of laser beam scanning module was studied. The study confirms the feasibility of finishing the processing of micro holes whose diameter is less than 2mm on the new CMC-SiC. And the preliminary optimization of processing parameters is completed. According to the experimental results, the important factors affecting the quality of the micro holes were analyzed, and the factors are the processing power and the scanning speed. The results also show that the femtosecond laser processing technology can solve the difficulties of drilling mirco holes on the new CMC-SiC in our country's aerospace field. |
| 作者部门 | 瞬态光学技术研究室 |
| 收录类别 | EI |
| 语种 | 英语 |
| ISSN号 | 16609336 |
| 文献类型 | 会议论文 |
| 条目标识符 | http://ir.opt.ac.cn/handle/181661/22617 |
| 专题 | 瞬态光学研究室 |
| 推荐引用方式 GB/T 7714 | Feng, Wang,Luo, Jian Jun,Li, Ming,et al. A Study on the technical method of drilling micro holes on new CMC-SiC with femtosecond laser[C]:Trans Tech Publications Ltd, Kreuzstrasse 10, Zurich-Durnten, CH-8635, Switzerland,2014:3924-3930. |
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| 文件名称/大小 | 文献类型 | 版本类型 | 开放类型 | 使用许可 | ||
| A Study on the techn（7120KB） | 限制开放 | CC BY | 请求全文 | |||
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