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Temperature distribution induced spectral broadening of high-power diode lasers 会议论文
Components and Packaging for Laser Systems VI, San Francisco, CA, United states, 2020-02-03
Authors:  Wu, DI-Hai;  Zhang, Pu;  Liu, Bin;  Zah, Chung-En;  Liu, Xingsheng
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High-power diode lasers  spectral power distribution (SPD)  spectral broadening  temperature distribution  
High power 250W CW conductively cooled diode laser arrays with low-smile 会议论文
Components and Packaging for Laser Systems VI, San Francisco, CA, United states, 2020-02-03
Authors:  Zhang, Hongyou;  Zhu, Pengfei;  Fu, Tuanwei;  Li, Meiqin;  Lv, Ning;  Li, Wenwei;  Zah, Chung-En;  Liu, Xingsheng
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High power  low smile  conductive cooling  packaging technology  
Thermal design for the package of high-power single-emitter laser diodes 期刊论文
Optics and Laser Technology, 2020, 卷号: 129
Authors:  Wu, Di-Hai;  Zah, Chung-En;  Liu, Xingsheng
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High-power laser diodes  Thermal design  Thermal resistance  Heat sink  Submount  Heat spreading angle  
Wavelength locking in a large-smile diode-laser array using dual-beam transformation systems 期刊论文
Applied Optics, 2020, 卷号: 59, 期号: 11, 页码: 3399-3403
Authors:  Liu, Bin;  Liu, Hui;  Chen, Fenning;  Li, Haiyan;  Liu, Xingsheng
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Method to control near-field bowing of laser diode arrays by balancing the thermal-induced stress 期刊论文
OPTICAL ENGINEERING, 2020, 卷号: 59, 期号: 3
Authors:  Zhang, Hongyou;  Zah, Chung-En;  Liu, Xingsheng
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thermal  induced stress  diode laser arrays  near-field bowing  SMILE  
Reduction of beam divergence angle in laser-diode arrays with large smiles using a dual-beam transformation system 期刊论文
OPTICS COMMUNICATIONS, 2020, 卷号: 462
Authors:  Liu, Bin;  Liu, Hui;  Chen, Fenning;  Li, Haiyan;  Gao, Lei;  Zhu, Pengfei;  Liu, Xingsheng
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Diode laser array  Smile correction  Beam shaping  Optical system design  
半导体激光器光束匀化系统的光学设计 期刊论文
红外与激光工程, 2019, 卷号: 48, 期号: 12
Authors:  孙玉博;  熊玲玲;  张普;  王明培;  刘兴胜
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光束匀化  半导体激光器  微透镜阵列  光学设计  激光光学  
High-power low-smile vertically-stacked laser diode based on microchannel cooling 会议论文
Semiconductor Lasers and Applications IX, Hangzhou, China, 2019-10-21
Authors:  Zhang, Hongyou;  Cai, Lei;  Zah, Chung-En;  Liu, Xingsheng
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Thermal stress  laser diode array  SMILE effect  spectrum  
一种带准直的双侧制冷型医疗美容用半导体激光器系统 专利
专利类型: 实用新型, 专利号: CN202960761U, 申请日期: 2013-06-05, 公开日期: 2013-06-05
Inventors:  刘兴胜;  戴晔;  孙尧;  吴迪;  蔡磊
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一种可替换芯片的传导冷却型半导体激光器及其制备方法 专利
专利类型: 发明申请, 专利号: CN105720478A, 申请日期: 2016-06-29, 公开日期: 2016-06-29
Inventors:  王警卫;  侯栋;  高立军;  杨艳;  刘兴胜
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一种高功率半导体激光器及其制备方法 专利
专利类型: 发明申请, 专利号: CN105790071A, 申请日期: 2016-07-20, 公开日期: 2016-07-20
Inventors:  刘兴胜;  卢栋;  王警卫;  杨艳
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一种具有防腐结构的液体制冷型半导体激光器 专利
专利类型: 发明申请, 专利号: CN103956649A, 申请日期: 2014-07-30, 公开日期: 2014-07-30
Inventors:  刘兴胜;  宗恒军;  王警卫;  穆建飞;  梁雪杰
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一种半导体激光医疗制热调控方法 专利
专利类型: 发明申请, 专利号: CN104659650A, 申请日期: 2015-05-27, 公开日期: 2015-05-27
Inventors:  刘兴胜;  姚园林;  戴晔;  孙尧
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多发光单元半导体激光器空间光束轮廓的测试方法及装置 专利
专利类型: 发明申请, 专利号: CN104865052A, 申请日期: 2015-08-26, 公开日期: 2015-08-26
Inventors:  刘晖;  王昊;  孙翔;  沈泽南;  吴迪;  刘兴胜
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用于半导体激光器的准直器 专利
专利类型: 发明申请, 专利号: CN102162932A, 申请日期: 2011-08-24, 公开日期: 2011-08-24
Inventors:  熊玲玲;  刘兴胜;  张普;  李小宁;  王敏;  王晓飚
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一种防光反馈的高功率半导体激光加工光源系统 专利
专利类型: 实用新型, 专利号: CN203631976U, 申请日期: 2014-06-04, 公开日期: 2014-06-04
Inventors:  王敏;  王警卫;  蔡万绍;  刘兴胜
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一种医疗用高功率半导体激光器系统 专利
专利类型: 实用新型, 专利号: CN205198136U, 申请日期: 2016-05-04, 公开日期: 2016-05-04
Inventors:  关鹏;  蔡磊;  郑艳芳;  李英杰;  戴晔;  刘兴胜
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用于半导体激光器光纤耦合模块的连接装置 专利
专利类型: 实用新型, 专利号: CN203069837U, 申请日期: 2013-07-17, 公开日期: 2013-07-17
Inventors:  蔡万绍;  刘兴胜
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一种适应低温环境的半导体激光器系统及其波长调节方法 专利
专利类型: 发明申请, 专利号: CN103715603A, 申请日期: 2014-04-09, 公开日期: 2014-04-09
Inventors:  刘兴胜;  祝丽莉;  吴迪
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用于半导体激光器的准直器 专利
专利类型: 实用新型, 专利号: CN202133824U, 申请日期: 2012-02-01, 公开日期: 2012-02-01
Inventors:  熊玲玲;  刘兴胜;  张普;  李小宁;  王敏;  王晓飚
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