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Advances in G-stack diode laser using macro-channel water cooling and high thermal conductivity material packaging 会议论文
High-Power Diode Laser Technology XIX, Virtual, Online, United states, 2021-03-06
作者:  Han, Yang;  Sun, Lichen;  Fu, Tuanwei;  Gao, Lijun;  Zheng, Yanfang;  Chen, Yunzhu;  Zhang, Xiaojuan;  Yan, Minna;  Zhao, Sicheng;  Yang, Kai;  Gao, Lei;  Zah, Chungen;  Liu, Xingsheng
Adobe PDF(503Kb)  |  收藏  |  浏览/下载：158/1  |  提交时间：2021/06/28
G-Stack Diode Laser  Macro-Channel  High Thermal Conductivity Material  Continuous Wave Mode  Low Thermal Resistance  
High-side mode suppression ratio with a high-stability external-cavity diode laser array at 976 nm in a wide temperature and current range 期刊论文
Optics Communications, 2021, 卷号: 486
作者:  Liu, Bin;  Liu, Hui;  Zhu, Pengfei;  Liu, Xingsheng
Adobe PDF(1709Kb)  |  收藏  |  浏览/下载：156/2  |  提交时间：2021/02/08
External cavity  Diode laser  VBG  SMSR  
Temperature distribution induced spectral broadening of high-power diode lasers 会议论文
Components and Packaging for Laser Systems VI, San Francisco, CA, United states, 2020-02-03
作者:  Wu, DI-Hai;  Zhang, Pu;  Liu, Bin;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1435Kb)  |  收藏  |  浏览/下载：155/1  |  提交时间：2020/05/18
High-power diode lasers  spectral power distribution (SPD)  spectral broadening  temperature distribution  
High power 250W CW conductively cooled diode laser arrays with low-smile 会议论文
Components and Packaging for Laser Systems VI, San Francisco, CA, United states, 2020-02-03
作者:  Zhang, Hongyou;  Zhu, Pengfei;  Fu, Tuanwei;  Li, Meiqin;  Lv, Ning;  Li, Wenwei;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(697Kb)  |  收藏  |  浏览/下载：169/1  |  提交时间：2020/05/18
High power  low smile  conductive cooling  packaging technology  
Thermal design for the package of high-power single-emitter laser diodes 期刊论文
Optics and Laser Technology, 2020, 卷号: 129
作者:  Wu, Di-Hai;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(6158Kb)  |  收藏  |  浏览/下载：211/2  |  提交时间：2020/05/14
High-power laser diodes  Thermal design  Thermal resistance  Heat sink  Submount  Heat spreading angle  
Wavelength locking in a large-smile diode-laser array using dual-beam transformation systems 期刊论文
Applied Optics, 2020, 卷号: 59, 期号: 11, 页码: 3399-3403
作者:  Liu, Bin;  Liu, Hui;  Chen, Fenning;  Li, Haiyan;  Liu, Xingsheng
Adobe PDF(799Kb)  |  收藏  |  浏览/下载：172/2  |  提交时间：2020/04/27
Method to control near-field bowing of laser diode arrays by balancing the thermal-induced stress 期刊论文
OPTICAL ENGINEERING, 2020, 卷号: 59, 期号: 3
作者:  Zhang, Hongyou;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1418Kb)  |  收藏  |  浏览/下载：171/2  |  提交时间：2020/04/27
thermal  induced stress  diode laser arrays  near-field bowing  SMILE  
High-power low-smile vertically-stacked laser diode based on microchannel cooling 会议论文
Semiconductor Lasers and Applications IX, Hangzhou, China, 2019-10-21
作者:  Zhang, Hongyou;  Cai, Lei;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(835Kb)  |  收藏  |  浏览/下载：115/0  |  提交时间：2020/03/04
Thermal stress  laser diode array  SMILE effect  spectrum  
Easy method to measure the packaging-induced stress of a semiconductor laser diode by lasing wavelength shifting 期刊论文
Applied Optics, 2019, 卷号: 58, 期号: 24, 页码: 6672-6677
作者:  Zhang, Hongyou;  Fu, Tuanwei;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(794Kb)  |  收藏  |  浏览/下载：189/3  |  提交时间：2019/09/02
Experimental and theoretical analysis of the effect of packaging induced thermal stress on high-power laser diode arrays 会议论文
High-Power Diode Laser Technology XVII, San Francisco, CA, United states, 2019-02-03
作者:  Zhang, Hongyou;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(736Kb)  |  收藏  |  浏览/下载：133/2  |  提交时间：2019/07/08
Thermal stress  laser diode array  SMILE effect  spectrum  
Three-Dimensional Steady-State Thermal Model of a High Power Diode Laser 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS V, San Francisco, CA, 2019-02-04
作者:  Wu, Di-Hai;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1529Kb)  |  收藏  |  浏览/下载：127/1  |  提交时间：2019/06/28
high power diode laser  thermal model  heat spreading  thermal resistance  finite element method (FEM)  
Development of High Power Annular Diode Laser Array Using Hard Solder 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS V, San Francisco, CA, 2019-02-04
作者:  Hou, Dong;  Sun, Lichen;  Fu, Tuanwei;  Chen, Li;  Liang, Xuejie;  Cai, Lei;  Yang, Yan;  Wang, Jingwei;  Yan, Minna;  Zah, Chungen;  Liu, Xingsheng
Adobe PDF(1185Kb)  |  收藏  |  浏览/下载：280/3  |  提交时间：2019/06/28
Diode Laser Stack  Hard Solder  High Power  Stress  Annular  
Three-dimensional thermal model of high-power semiconductor lasers 期刊论文
APPLIED OPTICS, 2019, 卷号: 58, 期号: 14, 页码: 3892-3901
作者:  Wu, Di-Hai;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1854Kb)  |  收藏  |  浏览/下载：190/3  |  提交时间：2019/06/27
Thermal hydraulic performance of a microchannel heat sink for cooling a high-power diode laser bar 期刊论文
APPLIED OPTICS, 2019, 卷号: 58, 期号: 8, 页码: 1966–1977
作者:  Wu, Di-Hai;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(2571Kb)  |  收藏  |  浏览/下载：191/3  |  提交时间：2019/04/09
Quasi-CW performance and reliability of dual laser bars on a micro-channel cooler 会议论文
High-Power Lasers and Applications IX, Beijing, China, 2018-10-11
作者:  Zhang, Hongyou;  Chen, Li;  Zhao, Sen;  Wang, Boxue;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(768Kb)  |  收藏  |  浏览/下载：97/0  |  提交时间：2019/03/12
A method of designing water-cooled horizontal array diode lasers for uniform junction temperature 会议论文
Semiconductor Lasers and Applications VIII, Beijing, China, 2018-10-12
作者:  Wu, Di-Hai;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1465Kb)  |  收藏  |  浏览/下载：101/0  |  提交时间：2019/03/07
Three-dimensions thermal model of a high-power diode laser bar 期刊论文
APPLIED OPTICS, 2018, 卷号: 57, 期号: 33, 页码: 9868-9876
作者:  Wu, Di-Hai;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(2076Kb)  |  收藏  |  浏览/下载：199/2  |  提交时间：2018/12/10
Effect of submount thickness on near-field bowing of laser diode arrays 期刊论文
Applied Optics, 2018, 卷号: 57, 期号: 28, 页码: 8407-8411
作者:  Zhang, Hongyou;  Chen, Tianqi;  Zhang, Pu;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1049Kb)  |  收藏  |  浏览/下载：170/3  |  提交时间：2018/11/02
Thermally induced chirp studies on spectral broadening of semiconductor laser diode arrays 期刊论文
Applied Optics, 2018, 卷号: 57, 期号: 20, 页码: 5599-5603
作者:  Zhang, Hongyou;  Jia, Yangtao;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1168Kb)  |  收藏  |  浏览/下载：208/2  |  提交时间：2018/09/12
Thermomechanical Behavior of Conduction-Cooled High-Power Diode Laser Arrays 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 期号: 5, 页码: 818-829
作者:  Nie, Zhiqiang;  Lu, Yao;  Chen, Tianqi;  Zhang, Pu;  Wu, Dihai;  Wang, Mingpei;  Xiong, Lingling;  Li, Xiaoning;  Wang, Zhenfu;  Liu, Xingsheng;  Nie, ZQ (reprint author), Chinese Acad Sci, State Key Lab Transient Opt & Photon, Xian Inst Opt & Precis Mech, Xian 710119, Shaanxi, Peoples R China.
Adobe PDF(2340Kb)  |  收藏  |  浏览/下载：240/1  |  提交时间：2018/05/31
Component Architectures  Semiconductor Device Packaging