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A compact killowatt-level QCW high-power semiconductor laser array based on dual-chip integration 会议论文
Semiconductor Lasers and Applications XII, Virtual, Online, China, 2022-12-05
作者:  Zhang, Pu;  Ren, Wenzhen;  Wang, Bo;  Zhu, Xiangping;  Yang, Junhong
Adobe PDF(512Kb)  |  收藏  |  浏览/下载：76/2  |  提交时间：2023/03/15
high-power semiconductor laser  packaging  dual-chip  
Generation of densely-spaced time-bin entangled qubits on a chip 会议论文
2021 Photonics North, PN 2021, Toronto, ON, Canada, 2021-05-31
作者:  Chemnitz, Mario;  Sciara, Stefania;  Fischer, Bennet;  Crockett, Benjamin;  Roztocki, Piotr;  Yu, Hao;  Wang, Zhiming;  Morandotti, Roberto;  Little, Brent E.;  Chu, Sai T.;  Moss, David J.
Adobe PDF(700Kb)  |  收藏  |  浏览/下载：81/0  |  提交时间：2022/02/10
time-bin entanglement  integrated quantum photonics  on-chip Mach-Zehnder interferometer  
Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Nie, Zhiqiang;  Wu, Di;  Lu, Yao;  Wu, Dhai;  Wang, Shuna;  Zhang, Pu;  Xiong, Lingling;  Li, Xiaoning;  Shen, Zenan
Adobe PDF(1806Kb)  |  收藏  |  浏览/下载：216/1  |  提交时间：2016/11/22
Chip Scale Packages  Defects  Degradation  Electronics Packaging  High Power Lasers  Laser Beam Welding  Power Semiconductor Diodes  Reliability  Reliability Analysis  Semiconductor Diodes  
A compact QCW conduction-cooled high power semiconductor laser array 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Zhu, Qiwen;  Zhang, Pu;  Wang, Shuna;  Wu, Dihai;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Liu, Xingsheng
Adobe PDF(1179Kb)  |  收藏  |  浏览/下载：278/3  |  提交时间：2016/11/22
Chip Scale Packages  Electronics Packaging  Finite Element Method  High Power Lasers  High Temperature Applications  Temperature