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Interface Contact Thermal Resistance of Die Attach in High-Power Laser Diode Packages 期刊论文
ELECTRONICS, 2024, 卷号: 13, 期号: 1
作者:  Deng, Liting;  Li, Te;  Wang, Zhenfu;  Zhang, Pu;  Wu, Shunhua;  Liu, Jiachen;  Zhang, Junyue;  Chen, Lang;  Zhang, Jiachen;  Huang, Weizhou;  Zhang, Rui
Adobe PDF(6228Kb)  |  收藏  |  浏览/下载：24/0  |  提交时间：2024/02/23
die attach  interface contact thermal resistance  thermal management  transient thermal analysis  structure function  high-power laser diode  
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling;  Wang, Shuna;  Wu, Dihai;  Liu, Xingsheng
Adobe PDF(2218Kb)  |  收藏  |  浏览/下载：239/1  |  提交时间：2016/11/22
Computer Simulation  Electronics Packaging  High Power Lasers  Numerical Models  Occupational Risks  Optical Properties  Packaging  Power Semiconductor Diodes  Shear Stress  Thermal Stress  
Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Nie, Zhiqiang;  Wu, Di;  Lu, Yao;  Wu, Dhai;  Wang, Shuna;  Zhang, Pu;  Xiong, Lingling;  Li, Xiaoning;  Shen, Zenan
Adobe PDF(1806Kb)  |  收藏  |  浏览/下载：216/1  |  提交时间：2016/11/22
Chip Scale Packages  Defects  Degradation  Electronics Packaging  High Power Lasers  Laser Beam Welding  Power Semiconductor Diodes  Reliability  Reliability Analysis  Semiconductor Diodes  
Thermal behavior of microchannel cooled high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Zhu, Qiwen;  Lu, Yao;  Dang, Yifan;  Liu, Xingsheng
Adobe PDF(2211Kb)  |  收藏  |  浏览/下载：356/2  |  提交时间：2016/11/22
Computational Fluid Dynamics  Copper  Crosstalk  Diodes  Electronics Packaging  Finite Element Method  Flow Of Water  Heat Resistance  Heat Sinks  Hydraulics  Laser Beam Welding  Microchannels  Numerical Methods  Optical Properties  Power Semiconductor Diodes  Reliability  Thermodynamic Properties  
A compact QCW conduction-cooled high power semiconductor laser array 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Zhu, Qiwen;  Zhang, Pu;  Wang, Shuna;  Wu, Dihai;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Liu, Xingsheng
Adobe PDF(1179Kb)  |  收藏  |  浏览/下载：278/3  |  提交时间：2016/11/22
Chip Scale Packages  Electronics Packaging  Finite Element Method  High Power Lasers  High Temperature Applications  Temperature  
Degradation of high power single emitter laser modules using nanosilver paste in continuous pulse conditions 期刊论文
MICROELECTRONICS RELIABILITY, 2015, 卷号: 55, 期号: 12, 页码: 2532-2541
作者:  Yan, Haidong;  Mei, Yunhui;  Li, Xin;  Zhang, Pu;  Lu, Guo-Quan;  Mei, YH
Adobe PDF(2559Kb)  |  收藏  |  浏览/下载：245/1  |  提交时间：2015/12/02
Nanosilver Paste  Laser Module  Die-attach Interface  Pulse Mode  Reliability  
Effects of Packaging on the Performances of High Brightness 9xx nm CW Mini-bar Diode Lasers 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS, San Francisco, CA, 2015-02-09
作者:  Li, Xiaoning;  Wang, Jingwei;  Feng, Feifei;  Liu, Yalong;  Yu, Dongshan;  Zhang, Pu;  Liu, Xingsheng
Adobe PDF(515Kb)  |  收藏  |  浏览/下载：229/1  |  提交时间：2015/12/04
High Power Diode Laser Stack Development Using Gold-Tin Bonding Technology 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS, San Francisco, CA, 2015-02-09
作者:  Hou, Dong;  Wang, Jingwei;  Zhang, Pu;  Cai, Lei;  Dai, Ye;  Li, Yingjie;  Liu, Xingsheng
Adobe PDF(1264Kb)  |  收藏  |  浏览/下载：207/0  |  提交时间：2015/12/04
Influence of Package Structure on the Performance of the Single Emitter Diode Laser 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2012, 卷号: 2, 期号: 10, 页码: 1592-1599
作者:  Li, Xiaoning;  Zhang, Yanxin;  Wang, Jingwei;  Xiong, Lingling;  Zhang, Pu;  Nie, Zhiqiang;  Wang, Zhenfu;  Liu, Hui;  Liu, Xingsheng
Adobe PDF(826Kb)  |  收藏  |  浏览/下载：256/1  |  提交时间：2013/10/09
Component Architectures  Semiconductor Device Packaging  
Thermal modeling and analysis of high power semiconductor laser arrays 会议论文
ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, August 13, 2012 - August 16, 2012
作者:  Zhiyong Zhang;  Pu Zhang;  Xiaoning Li;  Lingling Xiong;  Hui Liu;  Zhiqiang Nie;  Zhenfu Wang;  Xingsheng Liu
Adobe PDF(1758Kb)  |  收藏  |  浏览/下载：383/0  |  提交时间：2013/06/26