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High-power operation and lateral divergence angle reduction of broad-area laser diodes at 976 nm 期刊论文
Optics and Laser Technology, 2021, 卷号: 141
作者:  Liu, Yuxian;  Yang, Guowen;  Wang, Zhenfu;  Li, Te;  Tang, Song;  Zhao, Yuliang;  Lan, Yu;  Demir, Abdullah
Adobe PDF(1897Kb)  |  收藏  |  浏览/下载：167/3  |  提交时间：2021/05/08
Semiconductor laser  Diode laser  High power  High efficiency  Low divergence angle  High brightness  976 nm  
高功率半导体激光列阵芯片测试表征与仿真优化 期刊论文
发光学报, 2021, 卷号: 42, 期号: 5, 页码: 674-681
作者:  杜宇琦;  王贞福;  张晓颖;  杨国文;  李特;  刘育衔;  李波;  常奕栋;  赵宇亮;  兰宇
Adobe PDF(2052Kb)  |  收藏  |  浏览/下载：213/1  |  提交时间：2021/06/10
高功率  半导体激光列阵芯片  高温特性  能量损耗分布  
Advances in G-stack diode laser using macro-channel water cooling and high thermal conductivity material packaging 会议论文
High-Power Diode Laser Technology XIX, Virtual, Online, United states, 2021-03-06
作者:  Han, Yang;  Sun, Lichen;  Fu, Tuanwei;  Gao, Lijun;  Zheng, Yanfang;  Chen, Yunzhu;  Zhang, Xiaojuan;  Yan, Minna;  Zhao, Sicheng;  Yang, Kai;  Gao, Lei;  Zah, Chungen;  Liu, Xingsheng
Adobe PDF(503Kb)  |  收藏  |  浏览/下载：155/1  |  提交时间：2021/06/28
G-Stack Diode Laser  Macro-Channel  High Thermal Conductivity Material  Continuous Wave Mode  Low Thermal Resistance  
Method to control near-field bowing of laser diode arrays by balancing the thermal-induced stress 期刊论文
OPTICAL ENGINEERING, 2020, 卷号: 59, 期号: 3
作者:  Zhang, Hongyou;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1418Kb)  |  收藏  |  浏览/下载：168/2  |  提交时间：2020/04/27
thermal  induced stress  diode laser arrays  near-field bowing  SMILE  
Easy method to measure the packaging-induced stress of a semiconductor laser diode by lasing wavelength shifting 期刊论文
Applied Optics, 2019, 卷号: 58, 期号: 24, 页码: 6672-6677
作者:  Zhang, Hongyou;  Fu, Tuanwei;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(794Kb)  |  收藏  |  浏览/下载：188/3  |  提交时间：2019/09/02
Three-dimensional thermal model of high-power semiconductor lasers 期刊论文
APPLIED OPTICS, 2019, 卷号: 58, 期号: 14, 页码: 3892-3901
作者:  Wu, Di-Hai;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1854Kb)  |  收藏  |  浏览/下载：189/3  |  提交时间：2019/06/27
Thermal hydraulic performance of a microchannel heat sink for cooling a high-power diode laser bar 期刊论文
APPLIED OPTICS, 2019, 卷号: 58, 期号: 8, 页码: 1966–1977
作者:  Wu, Di-Hai;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(2571Kb)  |  收藏  |  浏览/下载：191/3  |  提交时间：2019/04/09
Development of High Power Annular Diode Laser Array Using Hard Solder 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS V, San Francisco, CA, 2019-02-04
作者:  Hou, Dong;  Sun, Lichen;  Fu, Tuanwei;  Chen, Li;  Liang, Xuejie;  Cai, Lei;  Yang, Yan;  Wang, Jingwei;  Yan, Minna;  Zah, Chungen;  Liu, Xingsheng
Adobe PDF(1185Kb)  |  收藏  |  浏览/下载：279/3  |  提交时间：2019/06/28
Diode Laser Stack  Hard Solder  High Power  Stress  Annular  
High-power low-smile vertically-stacked laser diode based on microchannel cooling 会议论文
Semiconductor Lasers and Applications IX, Hangzhou, China, 2019-10-21
作者:  Zhang, Hongyou;  Cai, Lei;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(835Kb)  |  收藏  |  浏览/下载：115/0  |  提交时间：2020/03/04
Thermal stress  laser diode array  SMILE effect  spectrum  
Characterizations of a Proposed 3300-V Press-Pack IGBT Module Using Nanosilver Paste for High-Voltage Applications 期刊论文
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2018, 卷号: 6, 期号: 4, 页码: 2245-2253
作者:  Feng, Jingjing;  Mei, Yunhui;  Li, Xianbin;  Lu, Guo-Quan
Adobe PDF(2834Kb)  |  收藏  |  浏览/下载：236/1  |  提交时间：2018/12/03
Electricity  Electronic Packaging  Joining Process  Nanoporous Materials  Thermal Resistance