Multi stack optical elements using temporary and permanent bonding

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	Multi stack optical elements using temporary and permanent bonding
其他题名	Multi stack optical elements using temporary and permanent bonding
	GODET, LUDOVIC; MCMILLAN, WAYNE; MEYER TIMMERMAN THIJSSEN, RUTGER; ARGAMAN, NAAMAH; ROY, TAPASHREE; DOSHAY, SAGE
	2019-10-17
专利权人	APPLIED MATERIALS, INC.
公开日期	2019-10-17
授权国家	美国
专利类型	发明申请
摘要	Systems and methods herein are related to the formation of optical devices including stacked optical element layers using silicon wafers, glass, or devices as substrates. The optical elements discussed herein can be fabricated on temporary or permanent substrates. In some examples, the optical devices are fabricated to include transparent substrates or devices including charge-coupled devices (CCD), or complementary metal-oxide semiconductor (CMOS) image sensors, light-emitting diodes (LED), a micro-LED (uLED) display, organic light-emitting diode (OLED) or vertical-cavity surface-emitting laser (VCSELs). The optical elements can have interlayers formed in between optical element layers, where the interlayers can range in thickness from 1 nm to 3 mm.
其他摘要	本文的系统和方法涉及使用硅晶片，玻璃或装置作为衬底的包括堆叠的光学元件层的光学装置的形成。本文讨论的光学元件可以制造在临时或永久基板上。在一些示例中，光学器件被制造为包括透明基板或包括电荷耦合器件（CCD）或互补金属氧化物半导体（CMOS）图像传感器，发光二极管（LED），微型LED（uLED）的器件。显示器），有机发光二极管（OLED）或垂直腔表面发射激光器（VCSEL）。光学元件可以具有形成在光学元件层之间的中间层，其中中间层的厚度可以在1nm至3mm的范围内。
主权项	A method of forming an optical device, comprising:(a) forming a pattern in a target layer on a first substrate, wherein the pattern comprises a plurality of islands separated by a plurality of trenches;(b) forming a fill layer on top of the patterned target layer and in the plurality of trenches formed in the patterned target layer to form a first optical element layer; and(c) forming an optical element layer stack on the first optical element layer by repeating (a) and (b) for a plurality of iterations.
申请日期	2019-02-22
专利号	US20190318957A1
专利状态	申请中
申请号	US16/283560
公开（公告）号	US20190318957A1
IPC 分类号	H01L21/768 \| H01L21/3213 \| H01L25/16 \| H01L25/04 \| H01L21/311
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/57266
专题	半导体激光器专利数据库
作者单位	APPLIED MATERIALS, INC.
推荐引用方式 GB/T 7714	GODET, LUDOVIC,MCMILLAN, WAYNE,MEYER TIMMERMAN THIJSSEN, RUTGER,et al. Multi stack optical elements using temporary and permanent bonding. US20190318957A1[P]. 2019-10-17.