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Effect of submount thickness on near-field bowing of laser diode arrays
Zhang, Hongyou1,2; Chen, Tianqi1,2; Zhang, Pu1; Zah, Chung-En3; Liu, Xingsheng1,2,3
Department瞬态光学技术国家重点实验室
2018-10-01
Source PublicationApplied Optics
ISSN1559128X;21553165
Volume57Issue:28Pages:8407-8411
Contribution Rank1
Abstract

Near-field bowing a laser diode bar (i.e., the “SMILE” effect) degrades the laser beam brightness, adversely affecting optical coupling and beam shaping. Due to thermally induced stress during the bonding process, the emitters in a laser diode array (LDA) are vertically displaced, which causes the SMILE effect. The mismatch between the coefficients of thermal expansion of an LDA (GaAs with 6.4 ppm/K) and a heat sink (Cu with 16.4 ppm/K) is a large obstacle in the LDA bonding process, because it provokes thermal stress and a large SMILE value, resulting in a larger divergence angle and a wider line after focusing and collimation. In this paper, the changes in stress and strain (SMILE value) and their effects on the laser bar as a function of the copper-tungsten (CuW) submount thickness were theoretically and experimentally studied. The finite element modeling simulations and experimental results show that the compression stress on the laser bar decreases with increasing CuW submount thickness because the CuW submount works as a buffer layer and can absorb stress. However, the laser bar out-of-plane strain (SMILE value) is approximately zero when the LDA is directly bonded onto the heat sink without a submount; the SMILE value is maximized when the CuW submount thickness is increased to approximately one half or 44% of the heat sink. Beyond that, the SMILE value decreases with increasing CuW submount thickness. © 2018 Optical Society of America.

DOI10.1364/AO.57.008407
Indexed BySCI ; EI
Language英语
WOS IDWOS:000446048600039
PublisherOSA - The Optical Society
EI Accession Number20184005902802
Citation statistics
Document Type期刊论文
Identifierhttp://ir.opt.ac.cn/handle/181661/30660
Collection瞬态光学技术国家重点实验室
Corresponding AuthorZhang, Hongyou
Affiliation1.State Key Laboratory of Transient Optics and Photonics, Xi’an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences, Xi’an, Shaanxi; 710077, China;
2.University of Chinese Academy of Sciences, Beijing; 100049, China;
3.Focuslight Technologies Inc., Xi’an, Shaanxi; 710077, China
Recommended Citation
GB/T 7714
Zhang, Hongyou,Chen, Tianqi,Zhang, Pu,et al. Effect of submount thickness on near-field bowing of laser diode arrays[J]. Applied Optics,2018,57(28):8407-8411.
APA Zhang, Hongyou,Chen, Tianqi,Zhang, Pu,Zah, Chung-En,&Liu, Xingsheng.(2018).Effect of submount thickness on near-field bowing of laser diode arrays.Applied Optics,57(28),8407-8411.
MLA Zhang, Hongyou,et al."Effect of submount thickness on near-field bowing of laser diode arrays".Applied Optics 57.28(2018):8407-8411.
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