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Design of high precision temperature control system for to packaged LD
Liang, Enji1,2; Luo, Baoke1; Zhuang, Bin1; He, Zhengquan1; He, Zhengquan (lajihuya@163.com)
2017
会议名称Applied Optics and Photonics China: 3D Measurement Technology for Intelligent Manufacturing, AOPC 2017
会议录名称AOPC 2017: 3D Measurement Technology for Intelligent Manufacturing
卷号10458
会议日期2017-06-04
会议地点Beijing, China
出版者SPIE
产权排序1
摘要

Temperature is an important factor affecting the performance of TO package LD. In order to ensure the safe and stable operation of LD, a temperature control circuit for LD based on PID technology is designed. The MAX1978 and an external PID circuit are used to form a control circuit that drives the thermoelectric cooler (TEC) to achieve control of temperature and the external load can be changed. The system circuit has low power consumption, high integration and high precision,and the circuit can achieve precise control of the LD temperature. Experiment results show that the circuit can achieve effective and stable control of the laser temperature. © 2017 SPIE.

作者部门信息光子学研究室
DOI10.1117/12.2283461
收录类别EI ; ISTP
ISBN号9781510613973
语种英语
ISSN号0277786X
引用统计
文献类型会议论文
条目标识符http://ir.opt.ac.cn/handle/181661/29862
专题信息光子学研究室
通讯作者He, Zhengquan (lajihuya@163.com)
作者单位1.Xi'An Institute of Optics and Precision Mechanics of CAS, Xi'an, Shannxi,710119, China
2.Shaanxi Normal University, Xi'an, Shannxi; 710119, China
推荐引用方式
GB/T 7714
Liang, Enji,Luo, Baoke,Zhuang, Bin,et al. Design of high precision temperature control system for to packaged LD[C]:SPIE,2017.
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