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Design of high precision temperature control system for to packaged LD
Liang, Enji1,2; Luo, Baoke1; Zhuang, Bin1; He, Zhengquan1; He, Zhengquan (lajihuya@163.com)
2017
Conference NameApplied Optics and Photonics China: 3D Measurement Technology for Intelligent Manufacturing, AOPC 2017
Source PublicationAOPC 2017: 3D Measurement Technology for Intelligent Manufacturing
Volume10458
Conference Date2017-06-04
Conference PlaceBeijing, China
PublisherSPIE
Contribution Rank1
Abstract

Temperature is an important factor affecting the performance of TO package LD. In order to ensure the safe and stable operation of LD, a temperature control circuit for LD based on PID technology is designed. The MAX1978 and an external PID circuit are used to form a control circuit that drives the thermoelectric cooler (TEC) to achieve control of temperature and the external load can be changed. The system circuit has low power consumption, high integration and high precision,and the circuit can achieve precise control of the LD temperature. Experiment results show that the circuit can achieve effective and stable control of the laser temperature. © 2017 SPIE.

Department信息光子学研究室
DOI10.1117/12.2283461
Indexed ByEI ; ISTP
ISBN9781510613973
Language英语
ISSN0277786X
Citation statistics
Document Type会议论文
Identifierhttp://ir.opt.ac.cn/handle/181661/29862
Collection信息光子学研究室
Corresponding AuthorHe, Zhengquan (lajihuya@163.com)
Affiliation1.Xi'An Institute of Optics and Precision Mechanics of CAS, Xi'an, Shannxi,710119, China
2.Shaanxi Normal University, Xi'an, Shannxi; 710119, China
Recommended Citation
GB/T 7714
Liang, Enji,Luo, Baoke,Zhuang, Bin,et al. Design of high precision temperature control system for to packaged LD[C]:SPIE,2017.
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